The PLE Series power inductor is a high-efficiency, low-leakage flux, ultra-compact power inductor that excels during operation with small batteries, such as those used in wearable devices.
Using our original structural design and newly developed materials, the PLE Series achieves a wide range of inductance values through advanced thin-film processes.
This chapter explains the structure and characteristics and provides other useful information including applications.　

TDK Corporation (TSE:6762) launches the ADL8030VA, a high-performance inductor designed specifically for power-over-coaxial (PoC) applications. Due to its high impedance over a wide frequency range, this component streamlines the PoC filter design by requiring only one single component instead of the conventional approach with two or more inductors. This significantly reduces complexity and cost in advanced driver-assistance systems (ADAS) and other automotive electronics, where space efficiency and reliability are critical. With the ADL8030VA, TDK is once again driving mobility transformation toward a more connected and safe future.

Since the advent of large language models (LLMs), artificial intelligence (AI) has been utilized in various scenarios, making AI a familiar presence.
The infrastructure technology supporting this AI utilization is a hardware system capable of advanced and large-scale parallel computation, known as AI accelerators. Currently, many AI accelerators are installed in data centers, but the server/storage/network systems traditionally used in data centers are not designed specifically for the operation of AI accelerators.
Therefore, to install AI accelerators in data centers and provide services that meet the demand for AI, many technical challenges need to be addressed. Among these, cooling of the equipment is considered the most critical issue, and the development of next-generation cooling methods for AI accelerator systems is underway. Among these, immersion cooling systems are said to be the most promising technology due to their significant cooling effects.
This article introduces our company's efforts regarding passive component products for AI accelerator systems using this immersion cooling method.

TDK extends AEC-Q200 qualified SMD alloy powder choke series ERU27M for rated currents up to 48 A. read more!

Increased demand for comfort functions and higher performing Advanced Driver Assistance Systems (ADAS) are requiring faster in-vehicle transmission interfaces. For image transmission using SerDes (LVDS), PoC (Power over Coax) has become mainstream to reduce the weight of the wiring harness by transmitting signal and supplying power within a single coaxial cable. The evolution of cameras used in automobiles continues with increased current capacity and faster image transmission for higher resolution images, as well as heating functions to defog the camera lens.
This article presents examples of the use and effects of PoC filter inductors and chip beads.

TDK Meister is an application software for Windows®, that can search TDK electronic components and display graphs for their characteristics. Using TDK Meister, you can easily select TDK electronic components that are optimum for electronic circuit design and EMC counter measure. In this article, overview and major functions of TDK Meister are introduced.

The formal name of Windows(R) is Microsoft(R) Windows(R) Operating System.<br>Microsoft(R) and Windows(R) are registered trademarks of Microsoft Corporation in the United States and/or other countries.

NFC stands for Near Field Communication, a type of short-range wireless communication.
Devices equipped with NFC can perform data transmission and authentication simply by being brought close to each other. This feature is rapidly being integrated into smartphones in recent times.
Additionally, its implementation is expanding to peripheral devices like wearable devices such as smartwatches.
NFC is widely used in cashless payment transactions and for connecting and authenticating peripheral devices. It holds the potential for diverse applications in realizing a touchless society.
This article introduces the main components used in NFC circuits, including NFC antennas, magnetic sheets, inductors for LC filters, and baluns for single-ended circuits.

Due to the widespread adoption of cloud computing, smartphones, and the continuous advancement of 5G technology, data being transmitted over the internet has been steadily increasing. This growth is fueled by evolving technologies, such as AI, and the increasing use of data-driven practices like big data and IoT, which are driving the evolution of digital transformation (DX).
In response to these market trends, semiconductor processors like CPU, GPU, FPGA, and others have made significant strides in their manufacturing process technology, with a notable focus on miniaturization. These advancements have led to increased gate integrations per unit area, higher operating frequencies, and substantial improvements in information processing capabilities.
In line with the improvement in processor capabilities, there have also been significant advancements in Server Power Circuits.

Automakers are incorporating more multifunctional capabilities into automobiles as they seek to make autonomous driving a reality. Electronic control units (ECUs) for advanced driver assistance systems are consuming more power, and the latest trend is toward ECU integration—installing an ECU close to the engine room or other working part.
For these reasons, the number of electronic devices and components built into cars these days is on the rise, and the reliability of the electronic components used in the electronics is having a growing impact on the reliability of the vehicle overall.